ATS-06D-152-C2-R0
AI

The **ATS-06D-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management line, designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits.
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## 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body) / Copper (Heat Pipe/Base variants available) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 3.32 °C/W (at 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 25mm |
| **Fin Type** | Fine-pitch Cross-cut |
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## 2. Key Electronic Features
### Thermal Management Efficiency
The primary electronic role of this part is **conduction and convection**. By increasing the surface area of the component it is attached to, it prevents "thermal throttling"—a state where electronic components reduce their clock speed to prevent permanent heat damage.
### PushPIN™ Attachment System
Unlike adhesive-based heat sinks, this part uses a mechanical fastening system:
* **Compression Springs:** Provides precise pressure to ensure maximum surface contact between the chip and the heat sink.
* **Plastic/Brass Pins:** Designed to fit into pre-drilled holes (typically 3.175mm) on a PCB.
* **Reliability:** Mechanical attachment is superior in high-vibration environments compared to thermal tape.
### Material & Coating
* **Aluminum Construction:** Offers a balance of lightweight design and high thermal conductivity.
* **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides a small amount of electrical insulation and increased corrosion resistance, which is vital for long-term PCB health.
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## 3. Physical Layout
The "Cross-cut" fin design is optimized for **omni-directional airflow**, meaning the electronic cooling efficiency is maintained regardless of which direction the system fans are blowing.
```text
[ Fins ] <--- Increased Surface Area
_____________
| |
| Base Plate | <--- Thermal Interface Material (TIM) applied here
|_____________|
| |
[Spring] [Spring] <--- pushPIN Mechanism
```
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## 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **06:** Series Identifier
* **D:** Specific mounting/design revision
* **152:** Dimensional code (35mm x 35mm)
* **C2:** Blue Anodized finish
* **R0:** RoHS Compliant (Lead-free and environmentally safe)
- ⤷
What is the recommended Thermal Interface Material (TIM) for this heat sink?
- ⤷ How do I calculate the required airflow (LFM) for this specific thermal resistance?
- ⤷ Are there alternative mounting options if my PCB lacks pushPIN holes?