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  • ATS-06D-152-C2-R0

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    The **ATS-06D-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management line, designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Copper (Heat Pipe/Base variants available) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.32 °C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Fin Type** | Fine-pitch Cross-cut | --- ## 2. Key Electronic Features ### Thermal Management Efficiency The primary electronic role of this part is **conduction and convection**. By increasing the surface area of the component it is attached to, it prevents "thermal throttling"—a state where electronic components reduce their clock speed to prevent permanent heat damage. ### PushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical fastening system: * **Compression Springs:** Provides precise pressure to ensure maximum surface contact between the chip and the heat sink. * **Plastic/Brass Pins:** Designed to fit into pre-drilled holes (typically 3.175mm) on a PCB. * **Reliability:** Mechanical attachment is superior in high-vibration environments compared to thermal tape. ### Material & Coating * **Aluminum Construction:** Offers a balance of lightweight design and high thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides a small amount of electrical insulation and increased corrosion resistance, which is vital for long-term PCB health. --- ## 3. Physical Layout The "Cross-cut" fin design is optimized for **omni-directional airflow**, meaning the electronic cooling efficiency is maintained regardless of which direction the system fans are blowing. ```text [ Fins ] <--- Increased Surface Area _____________ | | | Base Plate | <--- Thermal Interface Material (TIM) applied here |_____________| | | [Spring] [Spring] <--- pushPIN Mechanism ``` --- ## 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **06:** Series Identifier * **D:** Specific mounting/design revision * **152:** Dimensional code (35mm x 35mm) * **C2:** Blue Anodized finish * **R0:** RoHS Compliant (Lead-free and environmentally safe)
    ✨ Follow-up Questions
    • ⤷ What is the recommended Thermal Interface Material (TIM) for this heat sink?
    • ⤷ How do I calculate the required airflow (LFM) for this specific thermal resistance?
    • ⤷ Are there alternative mounting options if my PCB lacks pushPIN holes?