The **ATS-06D-164-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below is the breakdown of its physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 33.00mm | | **Thermal Resistance** | 2.41°C/W (at 100 LFM) | | **Weight** | ~0.35 lbs (approx.) | --- ### 2. Key Electronic Components Breakdown #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. This consists of: * **Brass/Plastic Pins:** Used to secure the heat sink to pre-drilled holes in the PCB. * **Compression Springs:** Provides consistent downward pressure (clamping force) on the electronic component, ensuring optimal contact with the Thermal Interface Material (TIM). #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of pre-applied thermal material. * **Material:** T766 (High-performance thermal grease). * **Function:** It fills microscopic air gaps between the electronic chip (heat source) and the aluminum base of the heat sink to maximize heat transfer. #### C. Fin Geometry The straight-fin design is optimized for **forced-air cooling**. In electronic enclosures with system fans, the air travels through the parallel channels, carrying heat away from the aluminum surface area. --- ### 3. Usage Context in Electronics This part is typically found in the following electronic environments: 1. **Telecommunications:** Used on high-speed switching chips. 2. **Power Electronics:** Dissipating heat from large MOSFETs or IGBTs. 3. **Embedded Systems:** Cooling processors on industrial-grade motherboards. --- ### 4. Comparison of Airflow Performance The efficiency of this heat sink depends on the velocity of the air provided by the electronic system's fans (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.41 | | 300 (1.5 m/s) | 1.14 | | 500 (2.5 m/s) | 0.89 |