The **ATS-06D-169-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Fine Pitch (Cross-Cut) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~15.71°C/W (Unducted Flow @ 100 LFM) | | **Spring/Pin Material** | Brass (Nickel Plated) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (Cross-Cut) This unit features a **fine-pitch design**. The "Cross-Cut" pattern creates small rectangular blocks (pins) rather than long continuous fins. This increases the surface area and allows for air to pass through from multiple directions, making it highly efficient for forced-air cooling environments. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a **spring-loaded push-pin** mechanism: - **Consistency:** Provides uniform pressure across the component surface for optimal thermal transfer. - **Reliability:** The springs ensure that the heat sink remains in contact with the chip even under mechanical vibration. - **Compatibility:** Designed for pre-drilled holes in a PCB (typically 20mm or 24mm hole patterns depending on the bracket). #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the part comes with **pre-applied thermal interface material**. This eliminates the need for manual application of thermal paste, ensuring a clean and standardized installation. --- ### 3. Application Use Cases The ATS-06D-169-C2-R0 is typically found in: * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and Single Board Computers (SBCs). * **Power Electronics:** Voltage regulators and motor drivers that generate localized heat. --- ### 4. Thermal Performance Comparison *At various airflow rates (LFM - Linear Feet per Minute):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.71 | | 300 | 1.5 | 7.91 | | 500 | 2.5 | 6.20 |