The **ATS-06D-17-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks designed for cooling semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06D-17-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 15.44 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 12.7mm | | **Fin Type** | Straight / maxiFLOW™ | --- ### 2. Breakdown of the Model Number The part number is coded to represent specific engineering attributes: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **06D**: Specific series designation (Heat sink geometry). * **17**: Height of the heat sink (approx. 12.7mm - 17mm range depending on series scaling). * **C2**: Thermal Interface Material (TIM) code. "C2" typically indicates **T766** (a high-performance phase-change material) pre-applied to the base. * **R0**: Revision/RoHS compliance status. --- ### 3. Key Electronic Cooling Features #### A. pushPIN™ Attachment Unlike traditional adhesive-based heat sinks, this model uses a **pushPIN™** system. This consists of a plastic or brass pin and a spring. * **Benefits**: Provides consistent pressure (Contact Pressure) on the chip to optimize heat transfer and allows for secure mounting in high-vibration environments. #### B. maxiFLOW™ Fin Geometry The "D" in the series often refers to the **maxiFLOW™** design, which features a flared fin structure. * **Purpose**: This design increases the surface area and creates turbulence in the airflow, which significantly reduces the thermal resistance compared to standard extruded heat sinks. #### C. Thermal Interface Material (TIM) The base comes pre-applied with a thermal pad or grease (indicated by the **C2** suffix). * **Function**: This fills microscopic air gaps between the semiconductor surface and the aluminum base, ensuring efficient heat conduction from the electronic component into the heat sink. --- ### 4. Typical Applications This component is generally used to cool the following electronic parts: 1. **BGA (Ball Grid Array) Packages**: Used in networking equipment and servers. 2. **CPUs/GPUs**: Low-profile processors in embedded systems. 3. **FPGAs**: High-speed programmable logic devices that generate significant heat in small footprints.