ATS-06D-172-C2-R0
AI

The **ATS-06D-172-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, specifically designed for cooling electronic components such as CPUs, GPUs, and other high-power ICs.
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### 1. Technical Specifications
The following table outlines the key physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 30.00mm x 30.00mm |
| **Height** | 25.00mm |
| **Fin Style** | Push-Pin (Square Fins) |
| **Thermal Resistance** | 5.71°C/W @ 100 LFM |
| **Attachment Method** | Push-Pin (Brass) |
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### 2. Electronic Application & Function
This part serves as a **passive thermal management component**. In an electronic circuit, it performs the following functions:
* **Heat Dissipation:** It increases the surface area of a heat-generating component (like a MOSFET or FPGA), allowing the ambient air to carry heat away more efficiently.
* **Protection:** By maintaining a lower junction temperature ($T_j$), it prevents thermal throttling and extends the lifespan of the semiconductor.
* **Airflow Optimization:** The square fin design is optimized for "omni-directional" airflow, meaning it performs well regardless of which direction the fan is blowing across the PCB.
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### 3. Attachment Mechanism: Push-Pin
The "R0" suffix and the Push-Pin design are critical for electronic assembly:
* **Spring-Loaded:** The brass push-pins use a compression spring to ensure even pressure across the top of the electronic chip.
* **Interface Material:** This model usually comes with **Phase Change Material (PCM)** or a pre-applied thermal interface pad on the base to bridge the microscopic air gaps between the chip and the aluminum.
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### 4. Thermal Performance Data
Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 5.71 |
| 200 | 2.85 |
| 300 | 2.11 |
| 400 | 1.74 |
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How do I calculate if this heat sink is sufficient for my chip's TDP?
- ⤷ What are the PCB hole requirements for the push-pin mounting?
- ⤷ Is there a version of this heat sink with a different attachment method like thermal tape?