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  • ATS-06D-172-C2-R0

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    The **ATS-06D-172-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, specifically designed for cooling electronic components such as CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Fin Style** | Push-Pin (Square Fins) | | **Thermal Resistance** | 5.71°C/W @ 100 LFM | | **Attachment Method** | Push-Pin (Brass) | --- ### 2. Electronic Application & Function This part serves as a **passive thermal management component**. In an electronic circuit, it performs the following functions: * **Heat Dissipation:** It increases the surface area of a heat-generating component (like a MOSFET or FPGA), allowing the ambient air to carry heat away more efficiently. * **Protection:** By maintaining a lower junction temperature ($T_j$), it prevents thermal throttling and extends the lifespan of the semiconductor. * **Airflow Optimization:** The square fin design is optimized for "omni-directional" airflow, meaning it performs well regardless of which direction the fan is blowing across the PCB. --- ### 3. Attachment Mechanism: Push-Pin The "R0" suffix and the Push-Pin design are critical for electronic assembly: * **Spring-Loaded:** The brass push-pins use a compression spring to ensure even pressure across the top of the electronic chip. * **Interface Material:** This model usually comes with **Phase Change Material (PCM)** or a pre-applied thermal interface pad on the base to bridge the microscopic air gaps between the chip and the aluminum. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 5.71 | | 200 | 2.85 | | 300 | 2.11 | | 400 | 1.74 |
    ✨ Follow-up Questions
    • ⤷ How do I calculate if this heat sink is sufficient for my chip's TDP?
    • ⤷ What are the PCB hole requirements for the push-pin mounting?
    • ⤷ Is there a version of this heat sink with a different attachment method like thermal tape?