The **ATS-06D-175-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 13.52°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (LxWxH)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Fin Style** | XC (Extra Coarse/Custom) | --- ### Component Breakdown #### 1. Heat Sink Geometry * **Dimensions:** It features a footprint of 35mm x 35mm and a low profile of 10mm. This makes it ideal for compact electronic enclosures where vertical space is limited. * **Fin Configuration:** The "cross-cut" design allows for multi-directional airflow, meaning it can dissipate heat effectively regardless of which direction the system fan is blowing. #### 2. Material and Coating * **Aluminum 6063:** This alloy provides a high thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer increases the surface emissivity, slightly improving radiative heat transfer, and protects the aluminum from corrosion. #### 3. Attachment Mechanism (pushPIN™) The "R0" designation typically refers to the attachment kit included. This system uses: * **Brass Push Pins:** These snap into pre-drilled holes in the PCB. * **Stainless Steel Springs:** These provide consistent pressure (compression) on the heat source, ensuring the thermal interface material (TIM) fills all microscopic gaps. #### 4. Thermal Performance Thermal resistance is measured in °C/W (degrees Celsius per Watt). A lower number is better. * **At 100 LFM (Linear Feet per Minute):** 13.52 °C/W. * **At 700 LFM:** 2.97 °C/W. * *Interpretation:* As airflow increases, the efficiency of this specific part improves drastically. --- ### Use Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Cooling FPGA or ASIC chips on line cards. * **Power Electronics:** Managing heat for voltage regulators and power modules.