### ATS-06D-187-C2-R0: Component Overview The **ATS-06D-187-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs that generate significant heat. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Mounting Type** | pushPIN™ (Brass/Plastic pins) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Clip-on with Compression Spring | | **Thermal Resistance** | 10.70 °C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | --- ### 2. Component Composition This part is not a single piece of metal but an assembly of several specialized electronic cooling components: 1. **Heat Sink Body:** A 45x45mm square aluminum block with a low profile (10mm). It uses a "straight fin" or "pin fin" pattern optimized for high-velocity airflow. 2. **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a similar high-performance grease to ensure maximum heat transfer from the chip to the aluminum. 3. **pushPIN™ Attachment:** The "R0" designation refers to the mounting kit, which includes: * **Springs:** Consistent pressure ensures the TIM is compressed correctly. * **Pins:** Designed to fit into pre-drilled holes on the PCB. --- ### 3. Thermal Performance (Airflow) The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 10.70 | | 400 (2.0 m/s) | 4.56 | | 600 (3.0 m/s) | 3.19 | | 800 (4.0 m/s) | 2.56 | --- ### 4. Typical Applications * **Networking:** Switches and routers where space is limited. * **Industrial PC:** Cooling embedded CPUs. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.