The **ATS-06D-197-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push-pin" series designed for cooling Integrated Circuits (ICs) and other PCB components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.30°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm | | **Attachment Method** | Push-Pin (with Compression Springs) | --- ### 2. Design and Component Features #### A. Fin Pattern (Cross-Cut) The "197" in the part number refers to a specific **cross-cut** fin design. This layout allows for multi-directional airflow, making it efficient in systems where the air direction might be turbulent or non-linear. #### B. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the part comes pre-applied with **T766 Phase Change Material**. This is an electronic-grade thermal grease or pad that ensures maximum heat transfer between the component (like a CPU or FPGA) and the aluminum heat sink. #### C. Attachment Mechanism Unlike adhesive-based heat sinks, this model uses a **push-pin and spring** system: * **Reliability:** Provides consistent pressure (load) on the component. * **Stability:** Prevents the heat sink from shifting during high-vibration environments. * **Hole Pattern:** Requires pre-drilled holes in the PCB. --- ### 3. Electronic Application Use-Cases This part is commonly used to manage the thermal profile of the following electronic devices: 1. **FPGAs & ASICs:** High-density chips used in networking and signal processing. 2. **Processors (CPUs/GPUs):** Low-profile cooling for embedded computing. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators in power supplies. ---