The **ATS-06D-199-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06D-199-C3-R0 | | **Attachment Method** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight | | **Dimensions (L x W x H)** | 50mm x 50mm x 6mm | | **Thermal Resistance** | 15.90 °C/W (at 100 LFM) | --- ## Key Components and Features ### 1. The pushPIN™ Attachment System The "R0" at the end of the part number signifies the use of the **pushPIN™** attachment mechanism. This consists of: * **Compression Springs:** These apply precise, uniform pressure across the component to ensure optimal thermal contact. * **Plastic/Brass Push Pins:** Used to secure the heat sink to the PCB through pre-drilled holes. ### 2. Thermal Interface Material (TIM) The "C3" in the part number indicates the type of thermal interface material pre-applied to the base of the heat sink. * **Material:** T766 (or equivalent high-performance grease). * **Purpose:** It fills microscopic air gaps between the electronic component (heat source) and the heat sink base to increase heat transfer efficiency. ### 3. Material and Fin Design * **Material:** Constructed from high-grade aluminum for a balance of thermal conductivity and weight. * **Fin Profile:** It uses a **Straight Fin** design. This is ideal for systems with a clear, directed airflow (forced convection), as it allows air to pass through the channels with minimal resistance. * **Finish:** The **Blue Anodized** coating is not just aesthetic; it protects the aluminum from corrosion and slightly increases emissivity. --- ## Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the silicon. Performance varies based on airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.90 | | 300 (1.5 m/s) | 10.70 | | 500 (2.5 m/s) | 8.30 | --- ## Application Use Cases 1. **Low-Profile Electronics:** Since the height is only 6mm, it is perfect for 1U servers or thin embedded systems. 2. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs). 3. **Communication Gear:** Heat dissipation for Network Switches and Routers.