The **ATS-06D-203-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 8.93 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.32 °C/W @ 500 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 54mm x 54mm x 10mm | | **Heat Sink Type** | XCUT (Cross-cut fin pattern) | --- ### 2. Design and Components #### Heat Sink Geometry * **Fin Type:** The "XCUT" design features a cross-cut pattern. This allows for multi-directional airflow, making it highly effective in systems where the direction of the air from the fan is not perfectly linear. * **Low Profile:** With a height of only **10mm**, this part is ideal for height-constrained environments like 1U servers or thin client devices. #### Attachment Mechanism (pushPIN™) The part utilizes a specialized mounting system: 1. **Push Pins:** Durable plastic or brass pins that lock into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide precise, uniform pressure across the thermal interface material (TIM) to ensure maximum heat transfer. 3. **Thermal Interface:** Usually comes pre-applied with a high-performance thermal component (T766) to reduce the thermal resistance between the chip and the aluminum. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06** | Product Series | | **D** | Attachment Type (D = pushPIN) | | **203** | Specific model/footprint size | | **C2** | Thermal Performance Grade / Material | | **R0** | RoHS Compliant / Revision code | --- ### 4. Thermal Performance Considerations The effectiveness of the ATS-06D-203-C2-R0 is highly dependent on airflow (LFM - Linear Feet per Minute). * **Low Airflow:** At 100 LFM, the resistance is **8.93 °C/W**, meaning for every watt of heat generated, the chip temperature rises ~9°C above ambient. * **High Airflow:** At 500 LFM, the resistance drops significantly to **2.32 °C/W**, showcasing its efficiency in forced-convection environments.