The **ATS-06D-207-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 6.39°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 60mm x 60mm x 6mm | | **Pressure Spring** | Stainless Steel | --- ### 2. Physical Design & Construction * **Low Profile:** With a height of only **6mm**, this heat sink is designed for tight spaces (1U or blade servers) where vertical clearance is limited. * **Cross-Cut Fin Pattern:** The fins are cut in both directions (cross-cut), creating a matrix of square pins. This allows for multi-directional airflow, meaning the heat sink remains effective regardless of which direction the fan is blowing. * **Pre-Applied Thermal Interface Material (TIM):** This specific model typically comes with **T766** phase-change material or similar, which simplifies the assembly process and ensures optimal thermal contact with the chip. --- ### 3. Electronic Application Use-Cases The ATS-06D-207-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Used on high-speed ASICs in network switches and routers. 2. **Embedded Computing:** Cooling microprocessors on PC/104 or COM Express boards. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators (VRMs). 4. **Industrial Controls:** Protecting sensors and control units from thermal throttling in fan-cooled enclosures. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.39 | | 400 (2.0 m/s) | 3.69 | | 600 (3.0 m/s) | 2.80 | --- ### 5. Assembly Breakdown ```text [ Push Pin ] <-- Brass/Plastic pin locks into PCB holes | [ Spring ] <-- Applies consistent downward pressure (approx. 2-4 lbs) | [ Heat Sink ] <-- Aluminum body absorbs heat | [ TIM Pad ] <-- Thermal interface fills microscopic air gaps | [ Component ] <-- The heat-generating chip (CPU/GPU/ASIC) ```