The part number **ATS-06D-21-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series, designed for thermal management of electronic integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-pin (with Compression Spring) | | **Thermal Resistance** | 23.35 °C/W @ (Natural Convection) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 10.00 mm | | **Pitch** | Super Fine | --- ## Key Components and Features ### 1. The Heat Sink Body * **Material:** Made from **Aluminum 6063**, which offers high thermal conductivity and is lightweight. * **Fin Design:** It features a **Straight Fin** profile. The "Super Fine" pitch means the fins are closely packed to maximize the surface area for heat dissipation within a low-profile height (10mm). * **Blue Anodized Finish:** This coating improves surface emissivity and provides corrosion resistance. ### 2. The pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical attachment system: * **Push-Pins:** Usually made of brass or plastic, these snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These provide a precise "Force" to ensure constant contact between the heat sink and the electronic component, preventing air gaps. ### 3. Thermal Interface Material (TIM) * The **"R0"** suffix typically indicates that the part comes pre-applied with **T766** thermal phase change material or a similar high-performance thermal pad. This ensures efficient heat transfer from the chip to the aluminum fins. --- ## Thermal Performance Data Performance varies based on the airflow (velocity) provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.33 | | 200 (1.0 m/s) | 6.02 | | 400 (2.0 m/s) | 2.87 | | 600 (3.0 m/s) | 1.81 | --- ## Applications * **BGA Packaging:** Ideal for cooling Ball Grid Array (BGA) components. * **Telecommunications:** Used in routers and switches. * **Embedded Systems:** Suitable for compact industrial computers where vertical space is limited.