The **ATS-06D-34-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide low thermal resistance in high-speed airflow environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 36.83mm x 36.83mm x 22.86mm | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Thermal Resistance** | 6.84°C/W (at 200 LFM) | | **Flow Orientation** | Directional (High-performance fins) | | **Interface Material** | T412 (Thermal Interface Material pre-applied) | --- ### 2. Core Electronic Components & Features The part is comprised of three main functional elements: #### A. Fin Design (maxiFLOW™) Unlike standard extruded heat sinks, the **C3-R0** variant uses a high-aspect-ratio fin geometry. This design increases the surface area for heat dissipation while maintaining a low pressure drop. The "Directional" nature means it performs best when the airflow is aligned with the fin channels. #### B. The pushPIN™ Attachment System To ensure reliable mechanical contact with electronic components (like CPUs, FPGAs, or GPUs), this part uses a spring-loaded push-pin system. This provides: * **Constant Pressure:** Ensures the thermal interface material (TIM) is compressed correctly. * **Vibration Resistance:** Securely locks the heat sink to the PCB. * **Ease of Assembly:** Quick installation without the need for complex brackets. #### C. Thermal Interface Material (T412) The "C3" in the part number indicates it comes pre-applied with **T412**. This is a high-conductivity phase-change or grease-like material that fills microscopic air gaps between the electronic chip and the aluminum base of the heat sink, significantly reducing thermal resistance. --- ### 3. Application Use Cases This component is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Managing heat from voltage regulators or power modules on a dense PCB.