The **ATS-06D-36-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Series** | pushPIN™ | High-performance thermal interface | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances emissivity and prevents corrosion | | **Base Dimension** | 36.83 x 36.83 mm | The footprint area of the heat sink | | **Height** | 15.00 mm | Low-profile design | | **Attachment** | Push-Pin | Secure mechanical mounting | | **Thermal Resistance** | 14.90 °C/W (at 100 LFM) | Rate of heat dissipation | --- ### 2. Design Characteristics This heat sink utilizes a **Fine Pitch** straight-fin design to maximize surface area for convective cooling. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied **T412** thermal interface material, which ensures low thermal resistance between the component and the heat sink. * **Airflow Direction:** Designed primarily for **vertical or horizontal** airflow, though it performs best in forced-air environments. * **Attachment Mechanism:** The "pushPIN™" system uses a brass or plastic pin with a stainless steel spring. This provides consistent pressure (load) to the component, improving thermal transfer and preventing damage during vibration. --- ### 3. Application Use Cases The ATS-06D-36-C3-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Thermal management for industrial PC processors. 3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.90 | 5.62 | 3.32 | 2.48 |