The **ATS-06D-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance (Flowing Air)** | 1.81°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 10.21°C/W | | **Fin Type** | Straight | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### Core Components and Features #### 1. Heat Sink Body * **Material:** Constructed from high-quality Aluminum 6063. * **Fin Geometry:** It features a vertical straight-fin design. This is optimized for systems with a specific direction of airflow, allowing air to pass through the channels and carry heat away from the base. * **Anodization:** The "C3" in the part number refers to the **Blue Anodized** finish, which increases surface emissivity and provides corrosion resistance. #### 2. Mounting Hardware (Push-Pin) * **Mechanism:** It uses a spring-loaded plastic push-pin. This ensures a constant, predefined pressure (load) on the component, which is critical for maximizing thermal transfer. * **Hole Pattern:** Designed for standard PCB hole spacing (typically 33mm in this series). #### 3. Thermal Interface Material (TIM) * The **T412** material pre-applied to the bottom is a high-performance phase-change material or thermal tape. It fills microscopic air gaps between the heat sink and the electronic component (CPU, FPGA, or GPU), significantly reducing thermal resistance at the contact point. --- ### Application Usage This part is typically used for cooling mid-range heat-generating components in: * **Networking Equipment:** Routers and switches. * **Industrial PCs:** Embedded controllers and automation hardware. * **Power Supplies:** Cooling MOSFETs or power ICs.