The **ATS-06D-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-density electronic cooling. --- ### 1. Technical Specifications The following table summarizes the core physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Thermal Resistance** | 1.50 °C/W (@ 200 LFM) | | **Fin Configuration** | Fine Pitch (Patterned for high surface area) | --- ### 2. Key Electronic Features #### A. Thermal Efficiency This part is designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) chips, CPUs, or GPUs. The **1.50 °C/W** thermal resistance rating indicates that for every watt of power dissipated, the temperature of the chip rises by 1.5 degrees Celsius above the ambient air. #### B. pushPIN™ Attachment The "R0" suffix often indicates the specific hardware mounting kit. The pushPIN™ system uses a flexible, spring-loaded mechanism that: * Ensures consistent pressure across the interface. * Prevents damage to the PCB (Printed Circuit Board). * Allows for easy installation and removal for maintenance. #### C. Airflow Optimization The **maxiFLOW™** design features a spread-fin geometry. Unlike standard straight-fin heat sinks, this design reduces pressure drop and maximizes air turbulence, making it highly effective in forced-air environments (systems with cooling fans). --- ### 3. Typical Applications * **Networking Equipment:** High-speed routers and switches. * **Computing:** Server processors and chipset cooling. * **Power Electronics:** Cooling for high-density power modules. * **Industrial Automation:** Integrated controllers generating significant heat. --- ### 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions) * **06:** Series/Designator * **D:** Performance/Material Grade * **45:** Footprint size (45mm) * **C3:** Finish/Coating (typically relates to Blue Anodized) * **R0:** Packaging and Mounting Hardware version