ATS-06D-47-C3-R0
AI

The **ATS-06D-47-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" component line.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 7.63°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 45.00 mm x 45.00 mm |
| **Height** | 25.00 mm |
| **Fin Style** | Pitch Fine-Pitch (Cross-cut) |
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### 2. Design and Components
The ATS-06D-47-C3-R0 is engineered for efficient heat dissipation in PCB environments where space and airflow are critical.
* **Cross-Cut Fin Design:** The "Fine-Pitch" pattern increases the surface area for heat to transfer from the metal to the air, making it ideal for systems with high-velocity airflow.
* **pushPIN™ Attachment:** This system includes a pre-assembled brass component and a stainless steel spring. It provides a secure, high-tension fit to the PCB, ensuring constant contact between the heat sink and the heat source (like a CPU or FPGA).
* **Thermal Interface Material (TIM):** This part typically comes with a pre-applied high-performance thermal pad or grease (T412), which fills microscopic air gaps between the component and the heat sink.
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### 3. Applications
This part is commonly used in industrial and telecommunications electronics to cool the following components:
1. **Processors (CPUs/GPUs):** Small form-factor computing modules.
2. **ASICs & FPGAs:** High-logic density chips that generate significant heat.
3. **Power Converters:** High-density power supplies requiring localized cooling.
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### 4. Part Number Breakdown
Understanding the ATS nomenclature:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **06:** Series/Push-pin style.
* **D:** Spring type/Force specification.
* **47:** Thermal performance profile/Fin configuration.
* **C3:** Finish and Thermal Material (Blue Anodized + T412 TIM).
* **R0:** Revision status.
- ⤷
What are the PCB hole requirements for the pushPIN™ mounting system?
- ⤷ How does the thermal resistance of this heat sink change at higher airflow (LFM)?
- ⤷ Are there alternative finishes to 'Blue Anodized' for this series?