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  • ATS-06D-47-C3-R0

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    The **ATS-06D-47-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" component line. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.63°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 25.00 mm | | **Fin Style** | Pitch Fine-Pitch (Cross-cut) | --- ### 2. Design and Components The ATS-06D-47-C3-R0 is engineered for efficient heat dissipation in PCB environments where space and airflow are critical. * **Cross-Cut Fin Design:** The "Fine-Pitch" pattern increases the surface area for heat to transfer from the metal to the air, making it ideal for systems with high-velocity airflow. * **pushPIN™ Attachment:** This system includes a pre-assembled brass component and a stainless steel spring. It provides a secure, high-tension fit to the PCB, ensuring constant contact between the heat sink and the heat source (like a CPU or FPGA). * **Thermal Interface Material (TIM):** This part typically comes with a pre-applied high-performance thermal pad or grease (T412), which fills microscopic air gaps between the component and the heat sink. --- ### 3. Applications This part is commonly used in industrial and telecommunications electronics to cool the following components: 1. **Processors (CPUs/GPUs):** Small form-factor computing modules. 2. **ASICs & FPGAs:** High-logic density chips that generate significant heat. 3. **Power Converters:** High-density power supplies requiring localized cooling. --- ### 4. Part Number Breakdown Understanding the ATS nomenclature: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **06:** Series/Push-pin style. * **D:** Spring type/Force specification. * **47:** Thermal performance profile/Fin configuration. * **C3:** Finish and Thermal Material (Blue Anodized + T412 TIM). * **R0:** Revision status.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN™ mounting system?
    • ⤷ How does the thermal resistance of this heat sink change at higher airflow (LFM)?
    • ⤷ Are there alternative finishes to 'Blue Anodized' for this series?