The **ATS-06D-55-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "push-pin" series designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 24.11°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35mm x 35mm x 10mm | --- ### 2. Physical Design & Dimensions The physical construction is optimized for low-profile applications where vertical space is limited. * **Footprint:** 35mm x 35mm (Standard for mid-sized ICs). * **Height:** 10mm (Ultra-low profile). * **Hole Pattern:** Designed for specific PCB layouts to ensure the pins align with pre-drilled holes in the circuit board. --- ### 3. Electronic Application This part is used in electronic assemblies to prevent **thermal throttling** or component failure. #### Use Cases: * **Power Converters:** Dissipating heat from high-current voltage regulators. * **Embedded Systems:** Cooling SoCs (System on Chips) in industrial computers. * **Telecommunications:** Managing heat in network switch processors. #### Key Benefits: * **Pre-assembled:** Comes with a pre-applied **Thermal Interface Material (TIM)**, reducing assembly time on the production line. * **Reliability:** The push-pin mechanism provides consistent pressure, ensuring a flat interface between the chip and the heat sink, which is critical for heat transfer. * **EMI Shielding:** While primarily for cooling, the aluminum structure can assist in grounding or reducing electromagnetic interference when properly integrated. --- ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how effectively the part moves heat away from the silicon. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 24.11 | | 300 (1.5 m/s) | 6.81 | | 500 (2.5 m/s) | 4.41 | *Note: As airflow increases, the efficiency improves significantly, dropping from 24.11 to 4.41 °C/W.*