ATS-06D-56-C3-R0
AI

The **ATS-06D-56-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is part of the **blueICE™** series, specifically designed for cooling electronic components like CPUs, GPUs, and high-density power modules.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 1.83 °C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Fin Pattern** | Straight Fin |
| **Weight** | 10.38 grams |
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### 2. Component Analysis
#### A. The pushPIN™ Attachment System
One of the defining "electronic part" features of this heat sink is the mounting mechanism. It uses a **pushPIN™** system which includes:
* **Compression Springs:** These provide a precise amount of pressure (Force) on the component to ensure optimal thermal contact.
* **Brass/Plastic Pins:** Used to secure the sink into pre-drilled holes on the PCB.
#### B. Thermal Interface Material (TIM)
The model number suffix (C3) indicates the presence of a pre-applied **Phase Change Material (PCM)**.
* This material acts as the bridge between the silicon die (electronic part) and the aluminum heat sink.
* It melts at a specific temperature to fill microscopic air gaps, drastically reducing thermal impedance.
#### C. Straight Fin Design
The "06D" series uses a straight fin geometry. This is optimized for **forced air cooling** (environments with a fan). The fins increase the surface area, allowing heat generated by the semiconductor to dissipate into the airflow.
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### 3. Electronic Application Usage
This part is typically found in the following electronic systems:
1. **Network Switches/Routers:** Cooling ASICs or FPGAs.
2. **Power Supplies:** Heat dissipation for MOSFETs or IGBTs.
3. **Embedded Systems:** Protecting small-form-factor processors from thermal throttling.
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### 4. Part Number Breakdown
`ATS-06D-56-C3-R0`
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **06D:** Design Series/Fin orientation.
* **56:** Specific size/height configuration.
* **C3:** Thermal Interface Material type (Phase Change).
* **R0:** Revision/RoHS compliance status.
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What is the difference between pushPIN and adhesive mounting for this heat sink?
- ⤷ How do I calculate if the 1.83 °C/W thermal resistance is sufficient for my CPU?
- ⤷ Are there alternative fin designs for natural convection (no fan) environments?