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  • ATS-06D-56-C3-R0

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    The **ATS-06D-56-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is part of the **blueICE™** series, specifically designed for cooling electronic components like CPUs, GPUs, and high-density power modules. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 1.83 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Pattern** | Straight Fin | | **Weight** | 10.38 grams | --- ### 2. Component Analysis #### A. The pushPIN™ Attachment System One of the defining "electronic part" features of this heat sink is the mounting mechanism. It uses a **pushPIN™** system which includes: * **Compression Springs:** These provide a precise amount of pressure (Force) on the component to ensure optimal thermal contact. * **Brass/Plastic Pins:** Used to secure the sink into pre-drilled holes on the PCB. #### B. Thermal Interface Material (TIM) The model number suffix (C3) indicates the presence of a pre-applied **Phase Change Material (PCM)**. * This material acts as the bridge between the silicon die (electronic part) and the aluminum heat sink. * It melts at a specific temperature to fill microscopic air gaps, drastically reducing thermal impedance. #### C. Straight Fin Design The "06D" series uses a straight fin geometry. This is optimized for **forced air cooling** (environments with a fan). The fins increase the surface area, allowing heat generated by the semiconductor to dissipate into the airflow. --- ### 3. Electronic Application Usage This part is typically found in the following electronic systems: 1. **Network Switches/Routers:** Cooling ASICs or FPGAs. 2. **Power Supplies:** Heat dissipation for MOSFETs or IGBTs. 3. **Embedded Systems:** Protecting small-form-factor processors from thermal throttling. --- ### 4. Part Number Breakdown `ATS-06D-56-C3-R0` * **ATS:** Advanced Thermal Solutions (Manufacturer). * **06D:** Design Series/Fin orientation. * **56:** Specific size/height configuration. * **C3:** Thermal Interface Material type (Phase Change). * **R0:** Revision/RoHS compliance status.
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive mounting for this heat sink?
    • ⤷ How do I calculate if the 1.83 °C/W thermal resistance is sufficient for my CPU?
    • ⤷ Are there alternative fin designs for natural convection (no fan) environments?