The **ATS-06D-76-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, or power transistors. --- ## 1. Technical Specifications The part number "ATS-06D-76-C2-R0" contains specific metadata regarding its dimensions, thermal performance, and attachment method. | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | Straight Fin (provides low pressure drop) | | **Thermal Resistance** | ~11.5°C/W (at 200 LFM airflow) | --- ## 2. Key Electronic Functions While the heat sink itself does not carry an electric current, it is critical for the stability of the electronic circuit: ### Heat Dissipation Its primary role is to increase the surface area of a semiconductor package. By transferring heat from the silicon die to the surrounding air, it prevents **Thermal Throttling** and **Permanent Failure** of the electronic part. ### pushPIN™ Attachment System The "76" in the part number indicates a specific attachment mechanism. It uses a flexible, secure attachment that ensures: * **Constant Pressure:** Maintains optimal contact between the heat sink base and the chip. * **Vibration Resistance:** Ideal for electronics used in industrial or automotive environments where movement occurs. --- ## 3. Material and Coating * **Aluminum AL6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides a small amount of electrical insulation and increases surface emissivity, slightly improving radiation cooling. --- ## 4. Typical Applications This specific size (25x25mm) is common in the following electronic assemblies: 1. **Network Switches/Routers:** Cooling small processors. 2. **Power Supplies:** Managing heat in MOSFETs or voltage regulators. 3. **Embedded Computing:** Protecting ARM-based SoCs in industrial controllers. ---