The **ATS-06D-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation in compact electronic systems. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-06D-80-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.93° C/W (at 100 LFM) | | **Dimensions (LxWxH)** | 30.00mm x 30.00mm x 15.00mm | | **Weight** | ~40.00 Grams | --- ### Key Features and Component Details #### 1. Heat Sink Geometry (Straight Fin) The device utilizes a **Straight Fin** design. This is optimized for systems with a clear airflow path (unidirectional flow). The fins increase the surface area available for convective heat transfer from the electronic component (CPU, GPU, or MOSFET) to the surrounding air. #### 2. pushPIN™ Attachment System Instead of using messy adhesives or simple clips, this part uses the proprietary **pushPIN™** mechanism: * **Compression Springs:** Provide precise, uniform pressure across the interface to ensure maximum thermal contact. * **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes on the PCB (Printed Circuit Board). #### 3. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the heat sink comes with a **Pre-applied Thermal Interface Material (T412)**. This is a "Phase Change" or high-performance pad that eliminates the need for external thermal paste, ensuring a low thermal resistance path between the chip and the aluminum base. #### 4. Blue Anodized Finish The surface is treated with a blue anodized coating. While visually distinct, this electrochemical process also: * Increases corrosion resistance. * Slightly improves surface emissivity for better radiation heat transfer. --- ### Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Cooling chips on network switch line cards. * **Power Electronics:** Managing heat for voltage regulators and high-speed transistors.