The **ATS-06D-82-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal interface material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Fin Type** | Straight Fin (provides high surface area for airflow) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Interface Material (TIM)** | T412 (High-performance thermal pad) | | **Thermal Resistance** | 10.97°C/W (at 100 LFM) | --- ### 2. Breakdown of the Electronic Parts The assembly consists of three main electronic/mechanical sub-components: #### A. The Heat Sink Body * **Material:** Extruded aluminum alloy. Aluminum is chosen for its high thermal conductivity and lightweight properties. * **Finish:** Blue Anodized. The anodization protects against corrosion and slightly increases emissivity for better radiation cooling. * **Fin Geometry:** The straight fins are optimized for unidirectional airflow, allowing heat to be carried away from the component via convection. #### B. The Attachment Mechanism (Push-Pins) * **Function:** This replaces adhesive tapes. It uses spring-loaded pins that snap into pre-drilled holes (usually 3.0mm) on the Printed Circuit Board (PCB). * **Benefit:** Provides consistent pressure on the component, ensuring maximum contact with the die and improving thermal transfer. It also allows for easier rework compared to epoxy. #### C. Thermal Interface Material (TIM) * **Part Reference:** T412. * **Role:** This is a pre-applied phase-change or pad material located at the base of the heat sink. It fills the microscopic air gaps between the heat sink and the electronic component to lower thermal impedance. --- ### 3. Application Use Cases This specific part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network switches. 2. **Embedded Systems:** Industrial PCs where space is limited but vertical clearance allows for a 25mm height. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.