The **ATS-06D-83-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic circuits, specifically for cooling components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.58°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring (ATS-PPS-06) | --- ### 2. Key Design Features * **Fin Geometry:** This model utilizes **Straight Fins**, which are optimized for unidirectional airflow. * **Thermal Interface Material (TIM):** This specific part number comes with **T412** thermal tape pre-applied. T412 is a high-performance, double-sided thermal tape that provides strong mechanical adhesion and high thermal conductivity. * **Push-Pin Attachment:** Instead of using clips or adhesive alone, it uses a mechanical push-pin system. This ensures consistent pressure across the component surface, which maximizes heat transfer. * **Airflow Efficiency:** The "C1" in the part number indicates a specific thermal performance grade designed to work efficiently even at low-to-medium airflow velocities. --- ### 3. Part Number Breakdown (Nomenclature) The part number follows a specific logic used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **06** | Attachment Hardware (Push-pin type/size) | | **D** | Material/Series Type | | **83** | Length and Width dimensions | | **C1** | Thermal performance/Fin configuration | | **R0** | RoHS Compliance / Revision code | --- ### 4. Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Telecommunications:** Heat dissipation for high-speed networking chips. * **Power Electronics:** Managing heat in voltage regulators and power converters. ---