The **ATS-06D-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic surface-mount components. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 2.50°C/W (at 100 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 15mm | | **Fin Style** | Fine Pitch (straight fins) | | **Attachment Method** | Push Pin (with Springs) | --- ### 2. Breakdown of Component Parts The assembly is not just a block of metal; it consists of several engineered parts that work together to dissipate heat: #### A. The Heat Sink Body * **Material:** Made of high-grade aluminum for excellent thermal conductivity. * **Design:** The "86" in the part number indicates a specific fin pattern designed to maximize surface area while allowing airflow from fans to pass through with minimal resistance. #### B. The Push Pin Mechanism * **Material:** Usually made of Brass or Plastic. * **Function:** These pins go through pre-drilled holes in the Printed Circuit Board (PCB). They provide a secure mechanical connection without the need for adhesive tapes that can fail over time. #### C. Compression Springs * **Function:** These are located on the push pins. They provide "firm and consistent" downward pressure. This is critical because it ensures the heat sink stays in tight contact with the chip, compensating for any vibrations or thermal expansion. #### D. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model usually comes with a pre-applied **Thermal Phase Change Material** or thermal pad on the base. This fills the microscopic air gaps between the chip and the metal to improve heat transfer. --- ### 3. Usage Context This part is commonly used in industrial and telecommunications equipment for: * **CPUs/GPUs:** Small form factor processors. * **FPGAs:** Programmable gate arrays that generate significant heat. * **ASICs:** Application-specific integrated circuits in networking gear.