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  • ATS-06D-88-C2-R0

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    The **ATS-06D-88-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 2.30 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 6.51 °C/W @ 0 LFM | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **06**: Series identifier. 3. **D**: Internal material/process code. 4. **88**: Specific footprint/geometry identifier. 5. **C2**: Color and Finish (specifically Blue Anodized). 6. **R0**: RoHS compliance status. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic circuit is critical: * **Heat Dissipation:** It increases the surface area of a hot component, allowing heat to transfer to the surrounding air more efficiently. * **Protection:** By maintaining a lower junction temperature ($T_j$), it prevents thermal throttling or permanent damage to integrated circuits. * **pushPIN™ System:** This specific model uses a flexible attachment system that includes a brass or plastic pin and a compression spring, ensuring even pressure on the electronic chip for optimal thermal contact. --- ### 4. Application Environments This part is commonly found in: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Embedded systems where airflow might be restricted. * **Power Supplies:** Cooling voltage regulators and MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of using pushPIN™ over traditional adhesive thermal tapes?
    • ⤷ How does the 'Blue Anodized' finish affect the thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom fan assembly for active cooling?