The **ATS-06D-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" family, designed for cooling electronic components like CPUs, GPUs, and power transistors on Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances surface durability and radiation | | **Dimensions** | 40mm x 40mm | Square base profile | | **Height** | 10.00mm | Low-profile design for space-constrained units | | **Thermal Resistance** | 22.01 °C/W (@ 100 LFM) | Rate of heat transfer efficiency | | **Attachment Type** | pushPIN™ | Spring-loaded attachment mechanism | | **TIM** | T412 | Pre-applied Thermal Interface Material | --- ### 2. Key Features and Components #### A. Fin Pattern: XC-CUT This heat sink utilizes an **XC-CUT** fin pattern. This is a cross-cut design that creates square or rectangular pins. * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, the cross-cut design allows air to enter from any direction, making it ideal for systems where airflow direction is inconsistent or turbulent. #### B. Attachment Mechanism (pushPIN™) The "R0" suffix refers to the specific attachment kit. * **Compression Springs:** It uses a brass or plastic push-pin with a stainless steel compression spring to ensure even pressure across the component surface. * **Secure Fit:** This prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip to maximize heat conduction. --- ### 3. Thermal Performance Analysis Thermal performance varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 | 200 | 400 | 600 | | :--- | :--- | :--- | :--- | :--- | | **Resistance (Unducted)** | 22.01 °C/W | 10.29 °C/W | 5.46 °C/W | 3.70 °C/W | | **Resistance (Ducted)** | 5.13 °C/W | 3.31 °C/W | 2.53 °C/W | 2.10 °C/W | --- ### 4. Application Use Cases * **Embedded Systems:** Due to its 10mm low profile. * **Networking Gear:** Used on switches and routers for cooling ASICs. * **Power Supplies:** Cooling voltage regulators and MOSFETs. ---