The **ATS-06D-99-C1-R0** is a specific electronic cooling component manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** Heat Sink series, designed for high-performance cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-pin (Fine Pitch) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 11.49°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (High Performance) | --- ### 2. Physical Design and Construction The part is engineered for optimal airflow and heat dissipation in tight spaces: * **Fins:** It features a **Straight-Fin** design. This is ideal for applications where air flows in a single direction, allowing for a lower pressure drop and efficient heat removal. * **Base:** The base is flat and pre-applied with **T766 thermal interface material (TIM)**. This ensures a low-resistance path for heat to move from the chip to the aluminum sink. * **Material:** Made from **Aluminum 6063**, which offers a balance between thermal conductivity, weight, and corrosion resistance. --- ### 3. Attachment Mechanism: pushPIN™ The suffix `R0` indicates the mounting hardware style. This specific model uses a spring-loaded push-pin system: 1. **Ease of Use:** It allows for quick installation on the Printed Circuit Board (PCB) without specialized tools. 2. **Constant Pressure:** The springs ensure that the heat sink maintains firm, consistent contact with the electronic part, even under mechanical stress or vibration. 3. **Stability:** The pins fit into pre-drilled holes in the PCB, preventing the heat sink from shifting. --- ### 4. Application Areas This part is commonly found in industrial and consumer electronics, including: * **Networking Hardware:** Routers, switches, and modems. * **Computing:** CPU/GPU auxiliary cooling and chipsets. * **Power Electronics:** Power supplies and motor controllers where thermal management is critical for longevity.