The **ATS-06E-08-C2-R0** is a high-performance electronic heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for high-power electronic components such as CPUs, GPUs, and power transistors. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Characteristic | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 17.78mm | | **Thermal Resistance (Unducted)** | 14.61 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.33 °C/W @ 100 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Features ### A. pushPIN™ Attachment System This heat sink utilizes a specialized push-pin mechanism. This allows for: * **Secure Mounting:** Spring-loaded pins provide consistent pressure for optimal thermal contact. * **Ease of Installation:** No specialized tools are required for mounting onto the PCB. * **Compatibility:** Designed for standard hole patterns (38.00mm pitch). ### B. Fin Design The "06E" in the part number indicates a specific fin geometry. The fine-pitch design maximizes the surface area within a compact footprint, facilitating better heat dissipation in forced-air environments. ### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application, ensuring a uniform layer that reduces the thermal resistance between the component and the heat sink. --- ## 3. Usage Context This part is typically used in the following scenarios: 1. **Telecommunications:** Cooling of networking processors. 2. **Industrial Controls:** Managing heat for high-power motor drivers or PLCs. 3. **Computing:** Secondary cooling for chipsets or power delivery modules. ---