ATS-06E-154-C2-R0
AI

The **ATS-06E-154-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The following table highlights the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance (Unducted)** | 4.84 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 2.85 °C/W @ 100 LFM |
| **Fin Style** | Fine Pitch (Cross-Cut) |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
---
### 2. Key Design Features
* **PushPIN™ Attachment:** This mechanism uses a brass pin and a stainless steel spring to provide a secure, high-pressure attachment to the PCB. This ensures optimal contact between the heat sink and the heat-generating component.
* **Cross-Cut Fin Design:** The "Fine Pitch" pattern allows for multi-directional airflow. Unlike straight-fin heat sinks, this design remains effective even if the airflow direction is inconsistent or restricted.
* **Thermal Interface Material (TIM):** The unit comes with **T766** pre-applied to the base. This eliminates the need for manual thermal paste application and ensures uniform heat transfer.
* **Component Compatibility:** The 40mm x 40mm footprint is a standard size for many high-speed networking chips and power management modules.
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### 3. Decoding the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **06** | Attachment Series (Push-Pin) |
| **E** | Finish / Material Code |
| **154** | Specific Design/Profile identifier |
| **C2** | Thermal Performance/Material Grade |
| **R0** | RoHS Compliant / Revision Number |
---
### 4. Implementation Example
If you were integrating this into a PCB design using software like Altium or KiCad, the mechanical footprint would look like this:
```text
PCB Footprint Requirements:
- Hole Diameter: 3.12mm (0.123")
- Pitch (Spacing): 33.00mm x 33.00mm
- Keep-out Zone: 42mm x 42mm (to account for pin overhang)
```
- ⤷
What are the benefits of using a pushPIN attachment over traditional adhesive tapes?
- ⤷ How does 'Ducted' vs 'Unducted' thermal resistance affect system design?
- ⤷ Are there alternative fin materials available for the ATS-06 series?