The **ATS-06E-192-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 30mm | | **Fin Style** | Straight (Vertical) | | **Thermal Resistance** | 2.35 °C/W (at 100 LFM) | | **Pitch** | Fine Pitch | --- ### 2. Key Electronic Components Breakdown #### A. Thermal Interface Material (TIM) The "R0" suffix indicates that this model comes pre-applied with a **T766 Phase Change Material**. This is the layer that sits between the component (chip) and the metal heat sink to fill microscopic air gaps, ensuring maximum heat transfer. #### B. Push-Pin Attachment Mechanism Instead of using messy adhesives or complicated brackets, this part uses a **brass/plastic push-pin system**. * **Compression Springs:** Ensure consistent pressure across the component to prevent localized overheating. * **Ease of Maintenance:** Allows for quick installation and removal during circuit board repairs or upgrades. #### C. Heat Dissipation Efficiency The fins are designed for "Fine Pitch," meaning they are spaced closely together. This increases the total surface area, allowing for better cooling in systems with restricted airflow. --- ### 3. Applications This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial motherboards where space is vertical but footprint is limited. 3. **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. ---