The **ATS-06E-32-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Heat Sink Type** | Top Mount / Fin | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | ~21.46°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | --- ### 2. Design and Construction The design of this specific heatsink is optimized for airflow and mechanical stability within a PCB environment. * **Fin Profile:** It typically utilizes a **Fine-Pitch** or **Cross-Cut** pattern. This maximizes surface area while maintaining a low profile (12.7mm height), making it ideal for tight enclosures. * **Thermal Interface Material (TIM):** The "C2" suffix indicates that the unit comes pre-applied with **T766 Phase Change Material**, which ensures efficient heat transfer from the chip to the aluminum base. * **Push-Pin Mechanism:** Instead of using adhesive tape or screws, it uses a spring-loaded push-pin system. This provides consistent pressure (preload) for better thermal performance and prevents the heatsink from shifting during mechanical shock or vibration. --- ### 3. Thermal Performance Data Performance varies based on the velocity of the air passing through the fins (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.46 | | 200 (1.0 m/s) | 11.77 | | 400 (2.0 m/s) | 6.58 | | 600 (3.0 m/s) | 4.79 | --- ### 4. Typical Applications This component is used in environments where electronic chips generate significant heat but vertical space is limited: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Processors:** Cooling FPGAs, ASICs, or BGAs.