The **ATS-06E-46-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 40mm x 25mm | | **Thermal Resistance** | 11.74°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Tapered / High-Performance Fin Pattern | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System This part uses a specialized "pushPIN" system. Instead of relying on messy adhesives, it uses a spring-loaded pin mechanism. This provides: * **Constant Pressure:** Ensures the heat sink maintains firm contact with the electronic chip for maximum heat transfer. * **Easy Rework:** Can be removed and reattached during hardware debugging without damaging the PCB. ### B. High-Performance Fin Design The **maxiFLOW™** geometry features a tapered fin design. In electronic enclosures where airflow is limited, this design: * Reduces pressure drop. * Increases the surface area for heat convection. * Maximizes air velocity through the "fin field." ### C. Pre-applied T766 TIM The "C2" in the part number indicates the thermal interface material. * It comes with **T766 phase-change material** pre-applied to the base. * This eliminates the need for manual thermal paste application, reducing assembly time and ensuring a uniform thermal bridge between the component and the aluminum. --- ## 3. Physical Dimensions (mm) | Length (A) | Width (B) | Height (C) | Pitch (E) | Pitch (F) | | :--- | :--- | :--- | :--- | :--- | | 45.00 | 40.00 | 25.00 | 38.00 | 38.00 | --- ## 4. Typical Applications This heat sink is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Converters and high-output power modules.