The **ATS-06E-50-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 19.03 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Pin Pitch** | 40.00mm | --- ### Key Electronic & Mechanical Features #### 1. Heat Sink Design (Fine Pitch) The "06E" series typically utilizes a **straight-fin or cross-cut design** to maximize surface area. This allows for efficient heat transfer from the base (which contacts the electronic component) to the surrounding air. #### 2. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a **spring-loaded push-pin** system. * **Benefits:** Ensures constant pressure on the electronic chip for optimal thermal contact. * **Reliability:** Reduces the risk of the heat sink vibrating loose during operation. #### 3. Thermal Interface Material (TIM) The part comes pre-applied with **T766 thermal phase change material**. This fills the microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. #### 4. Blue Anodized Finish The surface is treated with a blue anodized coating. While aesthetic, it also provides: * Increased corrosion resistance. * Improved emissivity for radiant heat transfer. * Electrical insulation on the surface of the aluminum. ### Performance Summary The efficiency of this part is highly dependent on airflow (LFM - Linear Feet per Minute): * **Low Airflow (100 LFM):** ~19.03 °C/W * **High Airflow (700 LFM):** ~2.39 °C/W ---