The **ATS-06E-53-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-06E-53-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Mounting Type** | pushPIN™ | | **Thermal Resistance** | 2.87°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Attachment Method** | Plastic Push Pins & Brass Springs | --- ### 2. Key Electronic Components & Design The "Electronic" aspect of this part refers to its integration into PCBA (Printed Circuit Board Assembly) thermal design. #### A. Fin Design (maxiFLOW™) Unlike standard straight-fin heat sinks, the maxiFLOW™ profile features a **tapered fin** geometry. This design increases the surface area while reducing pressure drop, allowing for maximum airflow efficiency across the electronic component it protects. #### B. The pushPIN™ Attachment To ensure reliable contact with the electronic chip, this part uses the pushPIN™ system: * **Compression Springs:** Provides specific "Force" (Pressure) to ensure the Thermal Interface Material (TIM) is compressed correctly. * **Push Pins:** Made of durable plastic or brass, these lock into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-53**, a high-performance thermal phase-change material. This ensures there are no microscopic air gaps between the heat sink and the electronic component. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **06E** | Series Identifier (maxiFLOW family) | | **53** | Dimensions/Fin Configuration code | | **C2** | Thermal Interface Material (T300/ATS-53) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Context This part is typically found in: * **Telecommunications:** Cooling high-speed processors in routers and switches. * **Industrial Power Supplies:** Dissipating heat from MOSFETs or IGBTs. * **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling.