The **ATS-06E-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-06E-64-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 9.39°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) The "C2" suffix indicates that this model comes pre-applied with **T766 phase-change material**. This is critical in electronics because it fills the microscopic air gaps between the heat sink and the electronic component (CPU, FPGA, or GPU), ensuring maximum heat transfer efficiency. #### B. Attachment System (Push-Pin) Unlike adhesive-based heat sinks, the push-pin mechanism provides: * **Constant Pressure:** Ensures the TIM is compressed correctly. * **Reliability:** Mechanical fastening is more resistant to vibration and thermal cycling than tapes. * **Ease of Assembly:** Features a flexible spring-loaded design for quick installation into pre-drilled PCB holes. #### C. Airflow Optimization The straight-fin design is optimized for **forced air cooling** (active cooling via fans). The spacing between the fins is engineered to minimize pressure drop while maximizing surface area for heat dissipation. --- ### 3. Common Applications This part is typically found in the following electronic environments: * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Computing:** Protecting industrial PC processors. * **Power Electronics:** Dissipating heat from high-wattage voltage regulators. ---