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  • ATS-06E-71-C2-R0

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    The **ATS-06E-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed specifically for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | ~6.67°C/W (Natural Convection) | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Key Design Components #### A. Fin Geometry This model features **straight fins**. This design is optimized for environments with high airflow speeds (forced convection), allowing air to flow smoothly through the channels to dissipate heat from the base. #### B. superGRIP™ Attachment One of the most critical "electronic parts" of this assembly is the mounting mechanism: * **Plastic Frame:** A high-strength clip that surrounds the electronic component. * **Metal Spring Clip:** A "cobra" shaped stainless steel spring clip that applies precise downward pressure. * **No Holes Required:** Unlike traditional heat sinks, this does not require holes in the PCB, protecting the circuit traces. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**, a thermal phase-change material. This fills the microscopic air gaps between the heat sink and the electronic chip (die), ensuring maximum heat transfer efficiency. --- ### 3. Applications This part is commonly found in the following electronic systems: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Telecommunications:** Thermal management for FPGA and ASIC chips. * **Industrial Computing:** Maintaining stability in high-temperature environments. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **06:** Product Series * **E:** Fin configuration/attachment type * **71:** Specific dimensions and fin height * **C2:** Material/Finish code (Blue Anodized Aluminum) * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷ How does the superGRIP attachment compare to push-pin mounting?
    • ⤷ What is the thermal resistance of this part under forced convection (airflow)?
    • ⤷ Is the T766 thermal interface material electrically conductive?