The **ATS-06E-86-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the core technical characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-06E-86-C2-R0 | | **Type** | Top Mount / Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 8.82°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | --- ### 2. Key Electronic & Mechanical Features #### A. Fin Design This model utilizes a **straight-fin** or **cross-cut** design (depending on the specific sub-series configuration) to maximize surface area. The height of 15mm is optimized for low-profile electronic enclosures where vertical space is limited but high heat dissipation is required. #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the "C2" designation often refers to the specific attachment kit included. * **Engagement:** The push-pin uses a pre-drilled hole in the PCB. * **Compression:** A built-in spring provides consistent pressure on the electronic component (CPU, FPGA, or GPU), ensuring an optimal interface with the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the part comes with **no pre-applied thermal tape** or a specific high-performance pad (T766). Users generally apply their own thermal paste or pad to ensure a low-resistance thermal path between the semiconductor and the aluminum fins. --- ### 3. Application Use Cases This component is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Heat management for SoCs (System on Chips). 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 4. **Industrial PCs:** Ensuring stability in fanless or low-airflow environments. ---