ATS-06F-01-C1-R0
AI

The **ATS-06F-01-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushpin" series designed for cooling integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
The following table summarizes the core electronic and physical attributes of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 21.90°C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Dimensions** | 40mm x 40mm x 6mm |
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### 2. Key Electronic Components Breakdown
#### A. Thermal Resistance Properties
The efficiency of this part is measured by its ability to transfer heat away from the silicon die.
* **Low Airflow:** At 100 LFM (Linear Feet per Minute), the resistance is approximately **21.90°C/W**.
* **High Airflow:** At 600 LFM, the resistance drops significantly to approximately **4.42°C/W**, showing it is optimized for forced-convection environments.
#### B. Fin Configuration
The "06F" in the part number refers to the **Fine Pitch** straight fin design. This increases the surface area for heat dissipation without significantly increasing the footprint of the electronic assembly.
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. In electronics, the TIM is critical because it fills microscopic air gaps between the heat source (CPU/GPU/FPGA) and the heat sink, ensuring maximum thermal conductivity.
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### 3. Usage in Circuit Design
In an electronic PCB (Printed Circuit Board) layout, the ATS-06F-01-C1-R0 is typically used for:
1. **High-speed Processors:** Cooling FPGAs or ASICs.
2. **Power Management:** Dissipating heat from high-current voltage regulators.
3. **Mechanical Stability:** The push-pin mechanism provides a consistent downward force (pressure), ensuring the component remains electronically and thermally stable under vibration.
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### 4. Part Number Decoder
```text
ATS - 06 - F - 01 - C1 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Color/Finish (Blue Anodized)
| | | +------------ Height (01 = 6mm)
| | +---------------- Fin Style (F = Fine)
| +--------------------- Series Number
+-------------------------- Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the significance of the T766 thermal interface material compared to standard thermal paste?
- ⤷ How does the push-pin mounting system impact the PCB layout requirements?
- ⤷ Can this heat sink be used for passive cooling without a fan?