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  • ATS-06F-01-C1-R0

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    The **ATS-06F-01-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushpin" series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 21.90°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions** | 40mm x 40mm x 6mm | --- ### 2. Key Electronic Components Breakdown #### A. Thermal Resistance Properties The efficiency of this part is measured by its ability to transfer heat away from the silicon die. * **Low Airflow:** At 100 LFM (Linear Feet per Minute), the resistance is approximately **21.90°C/W**. * **High Airflow:** At 600 LFM, the resistance drops significantly to approximately **4.42°C/W**, showing it is optimized for forced-convection environments. #### B. Fin Configuration The "06F" in the part number refers to the **Fine Pitch** straight fin design. This increases the surface area for heat dissipation without significantly increasing the footprint of the electronic assembly. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. In electronics, the TIM is critical because it fills microscopic air gaps between the heat source (CPU/GPU/FPGA) and the heat sink, ensuring maximum thermal conductivity. --- ### 3. Usage in Circuit Design In an electronic PCB (Printed Circuit Board) layout, the ATS-06F-01-C1-R0 is typically used for: 1. **High-speed Processors:** Cooling FPGAs or ASICs. 2. **Power Management:** Dissipating heat from high-current voltage regulators. 3. **Mechanical Stability:** The push-pin mechanism provides a consistent downward force (pressure), ensuring the component remains electronically and thermally stable under vibration. --- ### 4. Part Number Decoder ```text ATS - 06 - F - 01 - C1 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Color/Finish (Blue Anodized) | | | +------------ Height (01 = 6mm) | | +---------------- Fin Style (F = Fine) | +--------------------- Series Number +-------------------------- Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the significance of the T766 thermal interface material compared to standard thermal paste?
    • ⤷ How does the push-pin mounting system impact the PCB layout requirements?
    • ⤷ Can this heat sink be used for passive cooling without a fan?