The **ATS-06F-05-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Key Technical Specifications The model number encodes specific data regarding its size, material, and attachment method. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 0.94 °C/W (at 200 LFM) | --- ### 2. Design and Construction #### Fin Configuration This heatsink uses a **Fine Pitch** design with a cross-cut pattern. This increases the surface area significantly, allowing for better heat transfer in systems with high-velocity airflow (forced convection). #### Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves radiative heat transfer. #### Thermal Interface Material (TIM) The "C3" in the part number often indicates the type of pre-applied thermal interface. This model usually comes with **T412**, a high-performance phase-change material or thermal tape, ensuring there are no air gaps between the heatsink base and the electronic component (CPU/GPU/FPGA). --- ### 3. Attachment Mechanism: pushPIN™ The "06F" designation refers to the specific push-pin and spring combination used for mounting. * **Reliability:** The spring-loaded mechanism provides consistent pressure across the chip surface, preventing damage from over-tightening. * **Installation:** It requires pre-drilled holes in the PCB. The pins snap into place, making it ideal for high-volume manufacturing environments. * **Security:** Unlike adhesive tapes, the push-pin system is vibration-resistant and ensures the heatsink remains seated during mechanical shock. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity | 100 LFM | 200 LFM | 400 LFM | 600 LFM | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | ~1.50 | 0.94 | 0.60 | 0.45 | --- ### 5. Common Applications * **High-Speed Networking:** Routers, switches, and fiber-optic equipment. * **Processing Units:** Cooling FPGAs, ASICs, and high-end microprocessors. * **Power Electronics:** DC-DC converters and power modules that generate localized heat.