The **ATS-06F-07-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components like CPUs, GPUs, FPGAs, or other integrated circuits. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | Description | | :--- | :--- | :--- | | **Product Type** | Heat Sink | Passive cooling component | | **Material** | Aluminum | Lightweight with good thermal conductivity | | **Finish** | Blue Anodized | Increases surface area/protection | | **Attachment Method** | Push-Pin | Secure mechanical mounting | | **Spring Type** | Brass | Provides consistent pressure | | **Dimensions** | 45 x 45 x 10 mm | Length x Width x Height | | **Thermal Resistance** | 16.97°C/W (at 100 LFM) | Efficiency of heat dissipation | --- ### 2. Physical Design Features * **Fin Style (Straight Fin):** The "07" in the part number indicates a specific fin pattern. Straight fins are optimized for unidirectional airflow (e.g., in a server chassis or a case with a dedicated intake fan). * **Thermal Interface Material (TIM):** This part typically comes pre-applied with **T766**, a high-performance phase-change material that fills the microscopic gaps between the chip and the heat sink. * **Push-Pin Mounting:** Unlike adhesive tapes, the push-pin mechanism ensures a high "normal force," which improves thermal transfer and makes the assembly more resistant to shock and vibration. --- ### 3. Application Use-Cases The ATS-06F-07-C1-R0 is commonly used in environments where reliability and height constraints are critical: 1. **Telecommunications:** Cooling networking chips in switches and routers. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 10mm. 3. **Power Electronics:** Dissipating heat from high-speed voltage regulators. --- ### 4. Thermal Performance Data Thermal resistance depends on the Airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 16.97 | | 200 | 1.0 | 7.56 | | 400 | 2.0 | 4.05 | | 600 | 3.0 | 2.96 |