The **ATS-06F-110-C2-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for the thermal management of electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Thermal Resistance** | 0.85°C/W (@ 200 LFM) | | **Fin Style** | XC (Cross-Cut) / Straight Fin | | **Spring Type** | Brass | --- ### 2. Key Electronic Components & Features #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity-to-weight ratio. The "XC" pattern indicates a cross-cut design, which allows for multi-directional airflow, making it more effective in systems where air direction might be turbulent or inconsistent. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **R1** variant uses a mechanical push-pin system. - **Springs:** Includes high-tension springs that provide precise downward pressure (TIM - Thermal Interface Material compression), ensuring a flat contact between the component and the sink. - **Hardware:** Uses plastic push-pins and brass springs to prevent corrosion and electrical shorts while maintaining structural integrity. #### C. Thermal Interface Material (TIM) The "C2" in the part number typically refers to the pre-applied thermal interface. - **ATS-54:** A high-performance phase-change material or thermal grease is usually pre-applied to the base to fill microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Application Use Cases This part is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed switching chips. 2. **Industrial PC (IPC):** Ensuring stability for processors in fanless or high-vibration environments. 3. **Power Electronics:** Managing heat for large MOSFET arrays or power modules. --- ### 4. Thermal Performance Comparison Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better heat dissipation. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 0.85 | | 400 (2.0 m/s) | 0.61 | | 600 (3.0 m/s) | 0.52 |