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  • ATS-06F-116-C2-R0

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    The **ATS-06F-116-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** heat sink family designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.14°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Footprint / Dimensions** | 40.00mm x 40.00mm | | **Height** | 25.00mm | | **Pitch** | 45.00mm (Hole-to-Hole) | --- ### 2. Key Electronic Components This part is not an "electronic component" in the sense of a transistor or IC, but rather a **thermal management component**. Its primary parts include: 1. **Heat Sink Body (Fin Array):** Made of aluminum for high thermal conductivity. It uses a "straight fin" or "cross-cut" design to maximize surface area for heat dissipation. 2. **Push-Pins:** Plastic or metal fasteners that pass through pre-drilled holes in the PCB. They ensure the heat sink is securely locked onto the chip. 3. **Springs:** Specifically calibrated compression springs that provide consistent **downward pressure**, ensuring the base of the heat sink maintains perfect contact with the electronic component. 4. **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal pad or grease on the bottom to eliminate air gaps between the heat sink and the chip. --- ### 3. Applications The ATS-06F-116-C2-R0 is commonly found in: * **Networking Equipment:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators and power MOSFETs. * **Telecom:** High-speed data processing units. --- ### 4. Thermal Performance Table (Airflow) Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.14 | | 300 (1.5 m/s) | 2.15 | | 500 (2.5 m/s) | 1.63 | | 700 (3.5 m/s) | 1.40 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in heat sinks?
    • ⤷ How do I calculate the required hole size for the push-pin attachment?
    • ⤷ Can this heat sink be used with a custom fan shroud?