The **ATS-06F-118-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is a critical component in thermal management for electronic devices, specifically designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Fine Pitch (straight fin) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 6.54 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Attachment Method** | Push-Pin (Brass) | --- ### 2. Key Components & Design The "electronic part" functions as a passive heat exchanger. Its performance is derived from several design choices: * **Fin Profile:** It features a **Fine Pitch** straight-fin design. This increases the total surface area, allowing more air to come into contact with the metal, which is essential for forced-air cooling (fan-driven). * **Push-Pin Attachment:** Instead of using messy thermal adhesives or simple clips, it uses a mechanical push-pin system with a compression spring. This ensures consistent pressure against the chip for optimal thermal transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or a pre-applied phase-change material to fill microscopic air gaps between the heat sink and the component. --- ### 3. Thermal Performance Metrics Thermal resistance is measured in °C/W (Degrees Celsius per Watt). Lower values indicate better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (0.5 m/s) | 6.54 | | 300 LFM (1.5 m/s) | 3.16 | | 500 LFM (2.5 m/s) | 2.44 | | 700 LFM (3.5 m/s) | 2.09 | --- ### 4. Applications The ATS-06F-118-C2-R0 is commonly found in: * **Telecommunications:** Cooling FPGA and ASIC chips in routers and switches. * **Industrial PC:** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.