The **ATS-06F-119-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table breaks down the core physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Body) / Copper (optional base variation) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height (Fin)** | 20mm | | **Thermal Resistance** | 4.77°C/W (at 100 LFM) | | **Flow Orientation** | Fine-pitch (Straight Fin) | --- ### 2. Breakdown of the Part Number Structure Understanding the alphanumeric code helps in identifying its compatibility: * **ATS**: Brand (Advanced Thermal Solutions). * **06**: Product Series. * **F**: Fin pitch/density (F usually denotes Fine pitch for high airflow). * **119**: Specific dimension/geometry code. * **C3**: Thermal Interface Material (TIM). C3 indicates that **Phase Change Material** is pre-applied to the base. * **R0**: RoHS compliance status (Lead-free). --- ### 3. Key Electronic Components & Design The ATS-06F-119-C3-R0 consists of three main electronic/mechanical elements: #### A. The Fin Array The "Fine Pitch" design provides a high surface-area-to-volume ratio. This is critical for cooling power-dense components like FPGAs, CPUs, or high-speed networking chips where space is limited but heat output is high. #### B. The Push-Pin Mounting System Instead of using messy thermal adhesives or complex brackets, this part uses a **spring-loaded push-pin** mechanism. * **Benefit:** It provides consistent pressure across the chip surface (TIM compression), which improves thermal transfer and allows for easy maintenance or replacement. #### C. Thermal Interface Material (TIM) The "C3" designation means the bottom surface comes with a pre-applied layer of thermal pad or paste. This fills the microscopic air gaps between the heat source (the chip) and the heat sink base, ensuring maximum heat conduction. --- ### 4. Typical Applications This component is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and power modules.