The **ATS-06F-126-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Fin Style** | Straight Fin | | **Base Dimensions** | 54mm x 54mm | | **Height** | 10mm (Low Profile) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 5.47°C/W (at 100 LFM) | | **Interface Material** | T766 Phase Change (Pre-applied) | | **Finish** | Blue Anodized | --- ### 2. Key Components & Design Features #### A. Attachment System (pushPIN™) The "F" and "R0" in the part number indicate the specific attachment mechanism. It uses a flexible push-pin system with a compression spring. * **Benefits:** Ensures consistent pressure (clamped force) across the component, improving heat transfer. * **Hardware:** Usually requires 3.17mm diameter holes in the PCB. #### B. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * This is a "Phase Change Material" that softens when the component reaches operating temperature, filling microscopic air gaps between the chip and the heat sink for maximum efficiency. #### C. Fin Geometry It utilizes a **Straight Fin** design. This is optimized for "longitudinal" airflow, meaning it works best when there is a dedicated fan blowing air across the length of the fins. --- ### 3. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **06** | Attachment Type (pushPIN™) | | **F** | Fin Pitch/Designation | | **126** | Specific dimensions/series reference | | **C2** | Thermal Performance Class / Material Grade | | **R0** | RoHS Compliant / Revision code | --- ### 4. Applications * **Telecommunications:** Cooling for high-speed routers and switches. * **Computing:** Low-profile cooling for industrial motherboards. * **Embedded Systems:** Use in enclosures where vertical space is limited (only 10mm high).