The **ATS-06F-128-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.91°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 54mm x 54mm x 25mm | | **Fin Style** | Fine Pitch (Cross-Cut) | --- ### Key Electronic Components & Features #### 1. Heat Sink Body (The Fin Array) The "06F" in the part number indicates a specific fin geometry. The heat sink uses a **cross-cut** or **pin-fin** design. This increases the surface area significantly compared to a solid block, allowing air to circulate between the fins and carry away heat more efficiently via convection. #### 2. Thermal Interface Material (TIM) Most "C2" variants in this series come pre-applied with **T766 thermal phase change material** or a high-performance thermal grease. This component fills the microscopic air gaps between the heat sink base and the electronic chip (the heat source), ensuring maximum heat transfer. #### 3. PushPIN™ Attachment System Instead of simple adhesive, this part uses a mechanical attachment system consisting of: * **Brass/Plastic Push-Pins:** These go through pre-drilled holes in the PCB. * **Compression Springs:** These provide precise, uniform pressure (clamping force) on the electronic component. This is critical for maintaining consistent thermal contact without cracking the silicon die. #### 4. Blue Anodized Coating The surface is treated with a blue anodized finish. While aesthetically pleasing, it serves two functional purposes: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Emissivity:** Slightly improves heat dissipation through radiation. --- ### Usage in Circuits This part is typically used for cooling components with a high **TDP (Thermal Design Power)**. It is often found in: * Networking equipment (routers/switches). * Industrial power supplies. * Embedded computing boards where active cooling (fans) may not be feasible or where supplementary passive cooling is required.