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  • ATS-06F-134-C2-R0

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    The **ATS-06F-134-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-06F-134-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Type** | Fine-Pitch | | **Fin Pattern** | Cross-Cut | | **Thermal Resistance** | 4.44 °C/W (at 100 LFM) | | **Dimensions** | 70mm x 70mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ## Detailed Breakdown of Features ### 1. The pushPIN™ Attachment System This heat sink uses a specific mechanical mounting system called **pushPIN™**. * **Hardware:** It consists of a plastic or brass pin and a stainless steel compression spring. * **Benefit:** Provides a precise and consistent pressure across the component (like a CPU or GPU), ensuring optimal heat transfer and preventing damage to the PCB. ### 2. Fin Geometry: Fine-Pitch & Cross-Cut The "Fine-Pitch" design increases the surface area for heat dissipation. The "Cross-Cut" pattern allows for **omni-directional airflow**, meaning the cooling efficiency is maintained regardless of which direction the air enters the fin array. ### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This eliminates the need for separate thermal paste. * It fills microscopic air gaps between the component and the heat sink base to improve thermal conductivity. ### 4. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves the emissivity of the surface. --- ### ## Applications This specific heat sink is typically used for: * **High-speed processors:** FPGAs, ASICs, and high-performance CPUs. * **Telecommunications equipment:** Network switches and routers. * **Industrial Electronics:** Power supplies and motor controllers where vertical space is limited (15mm height).
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 4.44 °C/W thermal resistance rating?
    • ⤷ How does the pushPIN mounting compare to traditional adhesive thermal tape?
    • ⤷ Can this heat sink be used in a passive cooling setup without a fan?