The **ATS-06F-138-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here are the primary specifications: | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Material** | Aluminum (typically with Blue Anodized finish) | | **Thermal Resistance** | 12.23°C/W (at 1.0 m/s airflow) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 15.0mm | | **Fin Style** | Fine Pitch (cross-cut design) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™ system**. * **Mechanical Stability:** Uses a flexible spring mechanism to provide constant pressure on the electronic chip. * **Reliability:** Ensures maximum contact between the chip surface and the heat sink base. ### B. Thermal Interface Material (TIM) The part comes with **T412** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic component. * **Efficiency:** T412 is a high-performance thermal pad that eliminates the need for manual thermal paste application during assembly. ### C. Cross-Cut Fin Design The "F" in the part number denotes a specific fin geometry. * **Omnidirectional Airflow:** The fins are cut in a way that allows air to move through the sink from any direction. * **Heat Dissipation:** This increases surface area significantly compared to a flat block, allowing for faster cooling in compact electronic enclosures. --- ## 3. Applications This specific size (25mm x 25mm) is commonly used for: 1. **Network Switches:** Cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs and IoT gateways. 3. **Power Electronics:** Voltage regulators and high-current MOSFETs. ---