The **ATS-06F-148-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 8.73°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 15.0mm | | **Fin Style** | XC-CUT (High-flow cross-cut) | --- ### 2. Design Characteristics This heat sink is part of the **pushPIN™** line, which is characterized by several engineering features: * **Fin Geometry:** It uses a cross-cut (XC-CUT) fin pattern. This design allows for better airflow from multiple directions, making it more efficient in systems where air direction might fluctuate. * **Attachment Mechanism:** It utilizes a push-pin and compression spring system. This ensures even pressure across the component surface, optimizing the thermal interface material (TIM) performance. * **Material properties:** The AL6063 aluminum alloy provides a balance between high thermal conductivity and structural rigidity. --- ### 3. Thermal Performance Data Performance varies based on the airflow (Velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 (0.5 m/s) | 8.73 °C/W | | 300 (1.5 m/s) | 4.12 °C/W | | 500 (2.5 m/s) | 3.19 °C/W | | 700 (3.5 m/s) | 2.73 °C/W | --- ### 4. Typical Applications * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Cooling ASICs in networking switches and routers. * **Power Electronics:** Dissipating heat from MOSFETs and voltage regulators. --- ### 5. Installation Note To use this part effectively, the PCB must have pre-drilled holes matching the 30.0mm x 30.0mm pitch required for the push-pins. It is also recommended to use a high-quality Thermal Interface Material (TIM) between the component and the heat sink base.