The **ATS-06F-171-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Fin Style** | Fine-Pitch (Cross-Cut) | | **Attachment Method** | Push-Pin | | **Thermal Resistance (Flowing)** | 7.33 °C/W (@100 LFM) to 2.22 °C/W (@700 LFM) | | **Thermal Resistance (Static)** | 13.98 °C/W (Unducted) | --- ### 2. Key Electronic Components & Design Features #### A. The Fin Design (Cross-Cut) The "F" in the part number denotes a **Fine-pitch** pattern. Unlike standard straight fins, this model uses a cross-cut pattern that creates small square or rectangular pillars. This design: * Increases the surface area for heat exchange. * Allows for multi-directional airflow, making it less sensitive to the direction of the cooling fan. #### B. Attachment Mechanism (pushPIN™) The part uses a specialized **Push-Pin** system instead of adhesive tape. * **Components:** Brass or plastic pins and a high-tension compression spring. * **Benefit:** Provides consistent pressure (clamping force) on the electronic chip, which ensures maximum thermal transfer between the chip and the heat sink. #### C. Thermal Interface Material (TIM) The suffix **C2** indicates that the heat sink comes pre-applied with **ATS-PPS-2** thermal interface material. This is a high-performance thermal grease or pad that fills microscopic air gaps between the heat sink and the component to improve thermal conductivity. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **06** | Product Series (Push-Pin type) | | **F** | Fin Pitch (Fine) | | **171** | Specific dimension/geometry code | | **C2** | Thermal Interface Material (T766 / Blue Anodized) | | **R0** | Revision status / RoHS Compliant | --- ### 4. Application Use Case This part is typically found in: * **Telecommunications:** Cooling high-speed processors in routers and switches. * **Embedded Systems:** For industrial PCs where space is limited but heat output is high. * **Power Electronics:** For cooling VRMs (Voltage Regulator Modules) or MOSFETs. ---